Laser processing method and processing device
US7402772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2006 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Nov 14, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of the invention provide a laser processing apparatus and method. The laser processing apparatus includes a holder that holds a processing target, a first laser source that emits pulsed laser beam, and a second laser source that emits continuous-wave laser beam. The apparatus further includes an optical system that transmits the pulsed laser beam from the first laser source and the continuous-wave laser beam from the second laser source on a surface of the processing target held by the holder in such a manner that a beam spot of the pulsed laser beam is included inside a beam spot of the continuous-wave laser beam, and a moving mechanism that moves the beam spots of the pulsed laser beam and the continuous-wave laser beam on the surface of the processing target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.