Solder, microelectromechanical component and device, and a process for producing a component or device

US7402910B2 · kind B2 · utility

Assignees

• Micropelt GmbH · DE
• Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

• Harald Bottner · Glückstadt, DE
• Axel Schubert · Munich, DE
• Martin Jaegle · Waldkirch, DE

Key dates

• Filing date: Feb 27, 2004
• Grant date: Jul 22, 2008
• Expiry date: Feb 27, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing such components or devices.