Heat dissipation device
US7403389B2 · kind B2 · utility
5Cited by
6References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 20, 2005 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Dec 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink (10) and a fan (30). The heat sink includes a plurality of fins (15), and a guiding portion (184) is formed in the fins. The fan is secured to the heat sink. An airflow (F) is generated by the fan for flowing through the heat sink. When the airflow meets with the guiding portion, the airflow is deflected. The deflected airflow is guided to flow across heat-generating elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.