Highly-integrated MEMS-based miniaturized transceiver
US7403756B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2006 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Mar 31, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/30
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a highly-integrated MEMS-based miniaturized transceiver. The transceiver utilizes a low band front-end to direct sample low band signals and a high band front-end to translate high band signals that cannot be directly sampled to low band before low band front-end processing. The low band front-end comprises an array of High-Q MEMS (microelectromechanical systems)-based filters/resonators separated by isolation amplifiers in selectable cascade with narrower bandwidth filters. Dynamic tuning ability is provided through the isolation amplifiers and the sample frequency of the analog-to-digital converter. This architecture is amenable to monolithic fabrication. The input frequency range is scalable with analog-to-digital conversion sampling rate improvements. Re-utilization of filters is spatially efficient and cost effective. Tuning time is limited only by the analog-to-digital conversion and digital signal processing, not synthesizer settling times. This architecture eliminates major sources of traditional intermodulation distortion and reduces complex hardware, increasing reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.