Process for manufacturing optical and semiconductor elements
US7404756B2 · kind B2 · utility
12Cited by
27References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Oct 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical elements, semiconductor elements, or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.