Membrane attachment process
US7404873B2 · kind B2 · utility
0Cited by
30References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2004 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Oct 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/108
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method is provided for attaching a membrane to a substrate by heat-bonding the membrane to the substrate. The substrate includes a top surface, a bottom surface and a receptacle therethrough. The membrane can be a porous support structure combined with a polymeric gel. The method includes the steps of inserting a mandrel into the receptacle, placing the membrane on the substrate across the receptacle, heating the membrane and substrate, and allowing the substrate to cool to provide heat-bonded interlock between the substrate and the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.