Synthetic resin card and method of producing the same
US7404998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2004 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Dec 23, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A synthetic resin card in which card warpage can be reduced and a method for producing the same are provided. By setting the difference Δ in the angle of orientation between outer layers symmetrically laminated on a card core section, it is possible to reduce imbalance of stress resulting from the difference in the shrinkage factor between the outer layers, and card warpage can be suppressed. Furthermore, by setting the thickness of the outer layers at 25 μm to 125 μm, rising of the surface of the synthetic resin card can be reduced. By reducing the card warpage and the rising of the surface of the synthetic resin card, it is possible to improve moving characteristics when the synthetic resin card is allowed to move in a device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.