Wired circuit board
US7405479B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2005 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Sep 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer 3 is formed on a supporting board 2 so that insulating concave portions 13 are formed at portions thereof where external connecting terminals 8 are to be formed. A conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, the magnetic head connecting terminals 7, and the external connecting portions 8 are integrally formed, and conductive concave portions 9 are formed in the external connecting terminals 8. Thereafter, an insulating cover layer 10 is formed on the insulating base layer 3 so that the magnetic head connecting terminals 7 and the external connecting terminals 8 are exposed from the insulating cover layer 10. In the suspension board with circuit 1 thus formed, when the external connecting terminals 8 are connected with connecting terminals of a read/write substrate via the solder balls 21, reliable connection therebetween can be ensured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.