Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
US7405484B2 · kind B2 · utility
79Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2004 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Mar 14, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.