Inspection data producing method and board inspection apparatus using the method
US7406191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2003 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Jul 27, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2813
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
After a CAD data and a parts library are combined to produce an inspection data, the set data for the inspection window is automatically corrected using the image of a bare board for a board to be inspected. In this correcting process, an inspection window based on the aforementioned inspection data is set on a bare board image, and then an image in the inspection window W4 making up a reference for setting other windows is binarized, and lands 35 on this binary image are detected. Further, on the basis of the detection result, the set position and size of land windows W1 for solder inspection are corrected, after which the set positions of other inspection windows W2 to W4 are corrected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.