Semiconductor sensor
US7406870B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 14, 2005 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Dec 14, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/084
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor sensor is disclosed that includes a proof mass, a frame that is arranged around the proof mass, a beam that is arranged at the surface side of the frame and is configured to support the proof mass, plural piezo-resistive elements arranged on the beam, plural metal wiring patterns and pad electrodes that are arranged on the surface of the frame and are electrically connected to the piezo-resistive elements, a cover plate that is fixed to the surface of the frame and is arranged to be spaced apart from the proof mass and the beam, and a cover plate fixing region for fixing the cover plate to the surface of the frame, the cover plate fixing region including a formation region for the metal wiring patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.