Method of manufacturing article having uneven surface
US7407889B2 · kind B2 · utility
15Cited by
2References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 19, 2004 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Sep 8, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/33
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention improves a method of forming a surface unevenness using a difference in etching rates, and relaxes limitations on substrates in this method. In a method of the present invention, an uneven surface is formed by a method including applying pressure to a predetermined region in a surface of a thin film formed on a substrate, and etching a region including at least a portion of the predetermined region and at least a portion of the reminder of the surface that excludes the predetermined region. An etching rate difference within the thin film increases freedom in selecting a substrate material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.