Packaged integrated circuits and methods of producing thereof
US7408249B2 · kind B2 · utility
21Cited by
80References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 19, 2001 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Dec 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged integrated circuit and method for producing thereof, including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package enclosing the integrated circuit substrate and defining first and second planar surfaces generally parallel to the substrate plane and a plurality of electrical contacts, each connected to the electrical circuitry at the substrate plane, at least some of the plurality of electrical contacts extending onto the first planar surface and at least some of the plurality of electrical contacts extending onto the second planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.