Impedance control with reduced stiffness contribution from electrical interconnect
US7408744B1 · kind B1 · utility
7Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 12, 2005 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Jul 28, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for reduced contribution to suspension hinge stiffness of an electrical interconnect metal layer while retaining substantial impedance reductions from the metal layer use a sinuous pattern of removed and retained subregions of the metal layer selectively and distributively to ease bending of the metal layer and decrease its stiffness contribution while the retained metal layer subregions provide a substantial proportion of the impedance reduction normally provided by the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.