Compliant thermal interface structure utilizing spring elements with fins
US7408780B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2005 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Mar 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.