Multiple printed circuit board heat transfer guide plates
US7408782B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2007 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Mar 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1404
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink to conduct heat away from the PCBs. The PCBs are removably secured through a clamping mechanism that may be a screw type or cam lever action by clamping down on the exposed card edges, thus allowing thermal transfer to begin on all cards. The apparatus may be used with any enclosure requiring thermal transfer from PCBs to the enclosure, including cages and enclosures that may or may not use forced airflow (fans or blowers) for heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.