Radio-frequency circuit module and radio communication apparatus
US7409190B2 · kind B2 · utility
5Cited by
1References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 2005 |
| Grant date | Aug 5, 2008 |
| Priority date | — |
| Expiry date | Jun 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10075
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated-circuit element and passive components are mounted on a front face of a multilayer substrate. A capacitor constituting a crystal-oscillator circuit is disposed inside the multilayer substrate. A cavity is provided in a rear face of the multilayer substrate. A crystal oscillator constituting the crystal-oscillator circuit is accommodated in the cavity, and the cavity is sealed with a sealing cap made of a conductive material. The sealing cap is fixed to an electrode pad provided on a motherboard with solder therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.