Transferable micro spring structure
US7410590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2003 |
| Grant date | Aug 12, 2008 |
| Priority date | — |
| Expiry date | Jul 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0338
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then forming a base structure over the second release material layer. The micro spring structure is then transferred in an unreleased state, inverted such that the base structure contacts a surface of a selected apparatus, and then secured (e.g., using solder reflow techniques) such that the micro spring structure becomes attached to the apparatus. The spring structure is then released by etching or otherwise removing the release material layer(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.