Metal and electronically conductive polymer transfer
US7410825B2 · kind B2 · utility
69Cited by
38References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2005 |
| Grant date | Aug 12, 2008 |
| Priority date | — |
| Expiry date | Nov 16, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/13
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a donor laminate comprising in order, a substrate, an electronically conductive polymer layer in contact with said substrate, and a metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.