Chemical mechanical polishing slurry pump monitoring system and method
US7413497B2 · kind B2 · utility
0Cited by
3References
2Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Jun 12, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to one embodiment of the invention, a chemical mechanical polishing monitoring system includes a pump delivering a slurry to a polishing pad and a rotation sensing device coupled to the pump. The rotation sensing device senses a rotation of the pump and generates a signal indicative of the rotation of the pump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.