Bonding method of ceramic honeycomb structure
US7413625B2 · kind B2 · utility
4Cited by
1References
3Claims
0Family size
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Key dates
| Filing date | Jan 14, 2004 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Jan 14, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24149
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Respective pieces of the porous honeycomb segments (2) are stacked while interposing the adhesive layers between respective adhered surfaces (2a), and are bonded together by performing main pressurization (F1, F2) on the whole through the porous honeycomb segments (2) located on an outermost layer after stacking a predetermined number of pieces. Main pressurization force at this time is simultaneously applied to all the honeycomb segments (2) and does not act as a separating force against any of the honeycomb segments (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.