Fabrication methods and structures for micro-reservoir devices

US7413846B2 · kind B2 · utility

Assignee

• MicroCHIPS, Inc. · US

Inventors

• John M. Maloney · Medina, US
• Zouhair Sbiaa · Malden, US
• John T. Santini, Jr. · North Chelmsford, US
• Norman F. Sheppard, Jr. · New Ipswich, US
• Scott A. Uhland · San Jose, US

Key dates

• Filing date: Nov 15, 2004
• Grant date: Aug 19, 2008
• Expiry date: Mar 15, 2026

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B01L2400/0677
• WIPO field: Pharmaceuticals
• WIPO sector: Chemistry

Abstract

Methods are provided for making a multi-reservoir device comprising (i) patterning one or more photoresist layers on a substrate; (ii) depositing onto the substrate at least one metal layer by a sputtering process to form a plurality of reservoir caps and conductive traces; (iii) removing the photoresist layers using a liftoff process; (iv) forming a plurality of reservoirs in the substrate; (v) loading each reservoir with reservoir contents (such as a drug or sensor); and (vi) sealing each reservoir. Optionally, the reservoir cap comprises a first conductive metal layer coated with one or more protective noble metal films. To enhance the resistance of the substrate (e.g., a silicon substrate) to etching in vivo, the interior sidewalls of the reservoirs optionally can include a protective coating (e.g., gold, platinum, carbon, silicon carbide, silicon dioxide, and platinum silicide), or sidewalls comprising silicon can be doped with boron or another impurity.