Micro-fluid ejection head containing reentrant fluid feed slots
US7413915B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2004 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Oct 26, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1632
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.