Method of manufacturing a structural health monitoring layer
US7413919B2 · kind B2 · utility
16Cited by
33References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Mar 19, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01M5/0083
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods of manufacturing a diagnostic layer containing an array of sensing elements. The sensing elements, associated wires, and any accompanying circuit elements, are incorporated various layers of a thin, flexible substrate. This substrate can then be affixed to a structure so that the array of sensing elements can analyze the structure in accordance with structural health monitoring techniques. The substrate can also be designed to be incorporated into the body of the structure itself, such as in the case of composite structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.