Integrated circuit with offset pins
US7414308B2 · kind B2 · utility
0Cited by
17References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2005 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Apr 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit comprises a package and having adjacent connection pins on two opposite sides of the package, with every second connection pin being inwardly bent so that the connection pins are offset. The ends of the inwardly bent connection pins and the ends of the outer connection pins each lie on a straight line, where the offset connection pins are bent by different angles out of the plane of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.