Thermoformed frequency selective surface
US7414593B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2006 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | May 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q15/0046
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A three-dimensional FSS fabrication system is described. FSS elements are pre-mapped in two-dimensional form and constructed on a flat FSS panel that is then formed into a desired three-dimensional shape. The 2-D flat surface of the designed FSS is mapped into a desired three-dimensional curvature so that when formed from 2-D into the 3-D shape, the FSS elements are moved into a desired position and/or orientation. In one embodiment, the mapping from 2-D to 3-D is performed using the elastic properties of a desired substrate material. In one embodiment, one or more flat FSS panels are constructed on a formable or thermo-formable substrate. In one embodiment, the substrate includes a thermoplastic. In one embodiment, the substrate includes a thermoplastic material with fiber reinforcement. The FSS elements can be created by printing, deposition, photo-etching, etc. The flat FSS layers are thermoformed or chemically formed over a tool having the desired shape. In one embodiment, the FSS layers are formed to the shape of the tool by using vacuum techniques. In one embodiment, the FSS layers are formed to the shape of the tool by supporting the FSS layer between male and female tools.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.