Method of manufacturing thermal head
US7414641B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2006 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Mar 20, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3359
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Both ends of a head substrate in a longitudinal direction warp in a direction away from a cross section of a print substrate (in the convex shape) when a sealing resin is cured. A central portion of the head substrate in a longitudinal direction warps in a direction away from the cross section of the print substrate (in the concave shape) when heating elements emit heat. A curing condition when curing the sealing resin is changed corresponding to the concave-shaped warpage occurring when the heating elements emit heat, such that the convex-shaped warpage of the head substrate occurring when the sealing resin is cured is offset by the concave-shaped warpage of the head substrate and thus the heating elements are arranged in a straight line when the heating elements emit heat at the time of printing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.