Method and apparatus for a layered thermal management arrangement
US7414843B2 · kind B2 · utility
29Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2005 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | May 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one or more flow-regulation features having a first and second manifold to provide and regulate at least a portion of a first fluid flow to the plurality of first channels and to drain at least the portion of the first fluid flow from the plurality of first channels. Other embodiments may be described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.