Circuit board assembly for a liquid submersion cooled electronic device
US7414845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2007 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Apr 18, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, thereby improving the heat transfer from heat-generating components on the circuit board. For a computer, a plurality of heat-generating components are mounted on the motherboard, including a plurality of processors, a plurality of memory cards, a plurality of graphics cards, and a plurality of power supplies. A pump for the cooling liquid can also be mounted on the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.