IC tag and IC tag attachment structure
US7416135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2005 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Dec 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.