Patent · US Expired

Conductive adhesive bond

US7416420B2 · kind B2 · utility

0Cited by

8References

18Claims

0Family size

Assignee

Preh-Werke GmbH & Co. KG · DE

Inventors

Hans-Michael Schmitt · Münnerstadt, DE
Oswald Reuss · Unterelsbach, DE
Annegret Suckfuell · Mittelstreu, DE
Klaus Hemmert · Mittelstreu, DE

Key dates

Filing date	May 16, 2003
Grant date	Aug 26, 2008
Priority date	—
Expiry date	May 16, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01R4/04
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Conductive adhesive bonds are used preferably where the contact bonds are subject to great temperature variations, for example, on a throttle valve controller. In order to increase the mechanical stabilization of the conductive adhesive bonds, the surface of the contacts are machined and provided with structures such as ribbing, prickles, etc. As a result of this structuring, the conductive adhesive interlocks mechanically at these points. This leads to a high contact reliability also at extreme temperature changes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.