Patent · US Active

Laser rounding and flattening of cylindrical parts

US7416621B2 · kind B2 · utility

4Cited by
27References
28Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 22, 2005
Grant dateAug 26, 2008
Priority date
Expiry dateJan 4, 2027

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC21D10/005
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method is disclosed for rounding and/or flattening an annular part that is out of round and/or not flat due to non-uniform internal stresses. The part is first checked for out of round and/or out of flat conditions. Out of round parts are then rounded by introducing compressive stresses into selected surface sections of the part whereby the introduced compressive stresses cause deformation of the annular part thereby rounding the annular part. Alternatively, out of round parts are rounded by relieving compressive stresses in selected surface sections of the part whereby the relieving of compressive stresses causes deformation of the annular part thereby rounding the annular part. Out of flat parts are flattened by introducing compressive stresses into selected surface sections of the part whereby the introduced compressive stresses cause deformation of the annular part thereby flattening the annular part. Alternatively, out of flat parts are rounded by relieving compressive stresses in selected end surface sections of the part whereby the relieving of compressive stresses causes deformation of the annular part thereby flattening the annular part.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.