Laser rounding and flattening of cylindrical parts
US7416621B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 22, 2005 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Jan 4, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D10/005
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method is disclosed for rounding and/or flattening an annular part that is out of round and/or not flat due to non-uniform internal stresses. The part is first checked for out of round and/or out of flat conditions. Out of round parts are then rounded by introducing compressive stresses into selected surface sections of the part whereby the introduced compressive stresses cause deformation of the annular part thereby rounding the annular part. Alternatively, out of round parts are rounded by relieving compressive stresses in selected surface sections of the part whereby the relieving of compressive stresses causes deformation of the annular part thereby rounding the annular part. Out of flat parts are flattened by introducing compressive stresses into selected surface sections of the part whereby the introduced compressive stresses cause deformation of the annular part thereby flattening the annular part. Alternatively, out of flat parts are rounded by relieving compressive stresses in selected end surface sections of the part whereby the relieving of compressive stresses causes deformation of the annular part thereby flattening the annular part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.