Method for structuring a flat substrate consisting of a glass-type material

US7416961B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Hans-Joachim Quenzer · Berlin, DE
• Arne Schulz · Hamburg, DE
• Bernd Wagner · Looft, DE
• Peter Merz · Hanerau-Hademarschen, DE

Key dates

• Filing date: Mar 13, 2002
• Grant date: Aug 26, 2008
• Expiry date: Dec 1, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/16235
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Disclosed is a method for structuring a flat substrate consisting of a glass-type material. The invented method is distinguished by a combination of the following steps:providing a semiconductor flat substrate consisting of a semiconductor material, structuring at least one surface of said semiconductor flat substrate to obtain recesses in said surface,connecting said surface of said semiconductor flat substrate to said glass-type flat substrate, with said structured surface of said semiconductor flat substrate being connected to a surface of said glass-type flat surface at least partially covering the same,tempering said connected flat substrates in such a manner that at least a part of the said glass-type material flows into said recesses of said structured surface of said semiconductor flat substrate,removing material at least from the resolidified glass-type flat substrate in such a manner that said glass-type flat substrate assumes a surface which is flush with said structured surface of said semiconductor flat substrate.