Method of producing a MEMS device
US7416984B2 · kind B2 · utility
7Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2004 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | May 12, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00896
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.