Thermoplastic resin composition
US7417088B2 · kind B2 · utility
2Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Feb 22, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10L19/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a thermoplastic resin composition, more precisely, a thermoplastic resin composition with enhanced impact resistance, gloss, weather resistance and scratch resistance, compared with the conventional thermoplastic resin compositions, by containing an acrylate-styrene-acrylonitrile (ASA) graft copolymer, an aromatic vinyl compound and vinyl cyan compound copolymer, an alkyl methacrylate/aromatic vinyl compound/vinyl cyan compound terpolymer and a di-block copolymer (aromatic vinyl compound/vinyl cyan compound—alkyl methacrylate/aromatic vinyl compound/vinyl cyan compound).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.