Resorbable laminated repair film and method of using same
US7417174B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2004 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Nov 14, 2026 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61K38/00
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The present invention provides a reepithelialization/wound healing implant device comprising a barrier layer and one or more polymer layers doped with agents that promote one or more processes in reepithelialization/wound healing. The implant: [a] provides a temporary mechanical/chemical barrier to species within the external environment that inhibit epithelial migration (e.g., unbalanced production/expression of granulation tissue, inhibitory proteins); [b] biodegrades at an appropriate rate while tissue remodeling is occurring; and [c] delivers active cytokines and growth factors in a choreographed pattern to promote reepithelialization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.