ESD protection devices and methods of making same using standard manufacturing processes
US7417194B2 · kind B2 · utility
25Cited by
15References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 2004 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Jan 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.