Ultra-thin flexible inductor
US7417523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Aug 24, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
SMT-components known in the art usually have a thickness of approximately 1 mm and no flexibility. According to the present invention windings for an inductor are realized within a substrate, preferably by using copper layers which are already in the substrate. Then, thin metal sheet layers of high permeable material are laminated on top and bottom of the substrate. These layers are structured and then form the magnetic core of the inductor. Advantageously, an inductor may be provided with a very small building height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.