Head/slider supporting structure having lead wire inclined relative to slider pad
US7417827B2 · kind B2 · utility
3Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2005 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Feb 17, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.