Socket for testing semiconductor package
US7419378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2007 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | Nov 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7076
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Example embodiments of the present invention include a socket for testing a semiconductor package. The socket comprises a body having a through hole. A lower magnet is disposed in a lower region of the through hole, and a first type magnetic pole of the lower magnet is directed upward. An upper magnet is disposed in an upper region of the through hole, wherein the first type magnetic pole of the upper magnet is directed toward the lower magnet. The upper and lower magnets are structured to absorb a shock wave which is generated when the semiconductor package is arranged for testing. A conductive medium is disposed between the lower magnet and the upper magnet to electrically couple contactors of the semiconductor package to a base substrate of the socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.