Engineered non-polymeric organic particles for chemical mechanical planarization

US7419519B2 · kind B2 · utility

Assignee

• Dynea Chemicals Oy · FI

Inventors

• Yuzhuo Li
• Kwok Tang · Mississauga, CA
• Wu Li · 红钢城街道, CN
• Guomin Bian · Toronto, CA
• Krishnayya Cheemalapati · Potsdam, US
• Vivek Duvvuru · Potsdam, US
• Deenesh Bundi · Boise, US
• Henry Bian · Toronto, CA

Key dates

• Filing date: Jan 5, 2006
• Grant date: Sep 2, 2008
• Expiry date: Mar 6, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.