Data storage device enclosure with overmolded connector to provide conductive lead support
US7420769B2 · kind B2 · utility
0Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2004 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | Apr 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A storage apparatus that electrically connects to a central processor unit includes an enclosure having a surface and a printed circuit board. The printed circuit board is fixedly coupled to the surface of the enclosure and configured to operate the storage apparatus. The printed circuit board has a plurality of contact pads. The storage apparatus also includes an electrical connector having a plurality of conductive pins electrically coupled to the plurality of contact pads. An overmold section couples the electrical connector to the surface of the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.