Stackable splice chip device

US7421182B2 · kind B2 · utility

Assignee

• ADC Telecommunications, Inc. · US

Inventors

• Yilmaz Bayazit · Minneapolis, US
• Mark Smrha · West Chicago, US
• Oscar Fernando Bran de León · Belle Plaine, US
• Tom Tinucci · Chaska, US

Key dates

• Filing date: Dec 14, 2007
• Grant date: Sep 2, 2008
• Expiry date: Dec 14, 2027

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4454
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A splice tray arrangement including a tray and a splice chip arrangement. The splice chip arrangement including stackable splice chips defining channels for holding splice elements. Each of the splice chips including a mounting arrangement for mounting the splice chip at a mounting location on the tray, and a stacking arrangement for mounting the splice chip upon another splice chip.