Method of making pressure sensor assemblies
US7421773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2007 |
| Grant date | Sep 9, 2008 |
| Priority date | — |
| Expiry date | Apr 27, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4998
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Silicon-based high pressure sensor modules are manufactured in an array arrangement, incorporating a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. Bossed containers filled with oil are mounted on the substrate in an array. These bossed containers house the sensor cells which are composed of a sensor handle wafer and a diaphragm. The top surface of these bossed containers are flexible and deflect under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensors can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.