Method of forming a module component having a plurality of penetration holes
US7421781B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2004 |
| Grant date | Sep 9, 2008 |
| Priority date | — |
| Expiry date | Jan 12, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip component exposed; a peeling step of peeling the first molding die at a side of inserting the chip component; a secondary molding step of filling a second molding die with resin with a second end electrode of the chip component; and a forming step of forming a circuit wiring on one side or both sides of a molded element molded with resin, wherein the chip component is disposed according to a specified rule, and the chip component is molded with the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.