Method for characterizing porous low dielectric constant films
US7421885B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2005 |
| Grant date | Sep 9, 2008 |
| Priority date | — |
| Expiry date | May 25, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N15/0893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for determining pore size distribution and/or the presence of at least one killer pore in at least a portion of a porous film deposited upon a substrate are disclosed herein. In one embodiment, there is provided a method for determining pore size distribution comprising: providing the substrate having the film deposited thereupon wherein the film comprises pores and wherein the pores have a first volume; exposing the film to an adsorbate at a temperature and a pressure sufficient to provide condensation of the adsorbate in pores and wherein the pores after the exposing step have a second volume; and measuring the difference between the first and the second volume using a volumetric technique; and calculating the pore size and pore volume using the change in the first and the second volume, the pressure, and a model that relates pressure to pore diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.