Method for modifying circuit within substrate
US7422970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2005 |
| Grant date | Sep 9, 2008 |
| Priority date | — |
| Expiry date | Jul 25, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/961
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for modifying a circuit containing a plurality of electrodes, within a substrate, comprising the steps of: (a) selecting at least two electrodes for making a connection; (b) removing materials covering the electrodes with a focused ion beam (FIB) or a laser to form contact holes for respectively exposing the electrodes; (c) depositing in the contact holes a conductive material for forming electrically conductive piers, by applying the focused ion beam (FIB) or laser, with gas molecules ejected from a nozzle; (d) disposing an electrically conductive viscid material over each of the electrically conductive piers; and (e) disposing an electrically conductive bridge floor to connect with the electrically conductive viscid material to form an electrically conductive bridge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.