Patent · US Active

Aluminum nitride sintered body, semiconductor manufacturing member, and method of manufacturing aluminum nitride sintered body

US7422992B2 · kind B2 · utility

3Cited by
3References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 17, 2006
Grant dateSep 9, 2008
Priority date
Expiry dateAug 30, 2026

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2235/9661
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

An aluminum nitride sintered body is provided, which essentially contains aluminum nitride, 0.4 to 2.5 wt % magnesium and 2.0 to 5.0 wt % yttrium. The aluminum nitride sintered body has an average particle size of not more than 1.0 μm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.