Patent · US Expired

High responsivity high bandwidth metal-semiconductor-metal optoelectronic device

US7423254B2 · kind B2 · utility

14Cited by
11References
31Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 22, 2005
Grant dateSep 9, 2008
Priority date
Expiry dateMar 22, 2025

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D86/201

Abstract

An optical device for sensing an incident optical wave within a wavelength range includes a first array and a second array of electrodes superposed on a substrate, and a sensor connected to the contacts. The arrays are interdigitated. Each array includes its own parameters: contact width, contact thickness, groove width, and a groove dielectric constant. A structure associated with the arrays resonantly couples the incident wave and a local electromagnetic resonance or hybrid mode including at least a surface plasmon cavity mode (CM). For coupling the CM, an aspect ratio of contact thickness to spacing between electrodes is at least 1. A preferred structure for coupling a hybrid mode for high bandwidth and responsivity includes a higher dielectric constant in alternating grooves. The substrate may include silicon, including silicon-on-insulator (SOI). An SOI device having a alternating grooves with a higher dielectric, e.g., silicon oxide, provides 0.25 A/W and 30 GHz bandwidth.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.