High performance thermosiphon with internally enhanced condensation
US7424906B2 · kind B2 · utility
19Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2006 |
| Grant date | Sep 16, 2008 |
| Priority date | — |
| Expiry date | Oct 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.